Specifications:

• Module Size: 16 Gibibytes (ca. 17,2 Gigabytes)
• Memory Type: DDR4 SDRAM
• Moduly Type: Unbuffered DIMM (UDIMM)
• Memory Speed: 1333.3 MHz (DDR4-2666 / PC4-21300)
• Manufacturer: Samsung
• Module Part Number: M378A2K43CB1-CTD
• Module Revision: No (0.0)
• Module Serial Number: 1701500217 (39D56A65)
• Module Manufacturing Date: Year 2018, Week 26
• Error Check/Correction: No
• Address Bits: 16
• Column Address Bits: 10
• Module Density: 8192 Mb
• Number of Ranks: 2
• Device Width: 8 bits
• Bus width: 64 bits
• Die Count: 1
• Module Nominal Voltage (VDD): 1.2 V
• Minimum SDRAM Cycle Time (tCKAVGmin): 0.75000 ns
• Maximum SDRAM Cycle Time (tCKAVGmax): 1.60000 ns
• CAS# Latencies Supported: 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20
• Minimum CAS# Latency Time (tAAmin): 13.750 ns
• Minimum RAS# to CAS# Delay (tRCDmin): 13.750 ns
• Minimum Row Precharge Time (tRPmin): 13.750 ns
• Minimum Active to Precharge Time (tRASmin): 32.000 ns
• Supported Module Timing at 1333.3 MHz: 19-19-19-43
• Supported Module Timing at 1200.0 MHz: 17-17-17-39
• Supported Module Timing at 1066.7 MHz: 15-15-15-35
• Supported Module Timing at 933.3 MHz: 13-13-13-30
• Supported Module Timing at 800.0 MHz: 11-11-11-26
• Supported Module Timing at 666.7 MHz: 10-10-10-22
• Minimum Active to Active/Refresh Time (tRCmin): 45.750 ns
• Minimum Refresh Recovery Time Delay (tRFC1min): 350.000 ns
• Minimum Refresh Recovery Time Delay (tRFC2min): 260.000 ns
• Minimum Refresh Recovery Time Delay (tRFC4min): 160.000 ns
• Minimum Four Activate Window Delay Time (tFAWmin): 21.000 ns
• Minimum Active to Active Delay Time - Different Bank Group (tRRD_Smin): 3.000 ns
• Minimum Active to Active Delay Time - Same Bank Group (tRRD_Lmin): 4.900 ns
• Minimum CAS to CAS Delay Time - Same Bank Group (tCCD_Lmin): 5.000 ns
• Module Temperature Sensor (TSOD): Not Supported
• Module Nominal Height: 31 - 32 mm
• Module Maximum Thickness (Front): 1 - 2 mm
• Module Maximum Thickness (Back): 1 - 2 mm
• Address Mapping from Edge Connector to DRAM: Mirrored

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